Supercube grains leading to a strong cube texture and a broad grain size distribution after recrystallization
2015 (English)In: Philosophical Magazine, ISSN 1478-6435, E-ISSN 1478-6443, Vol. 95, no 22, p. 2427-2449Article in journal (Refereed) Published
Abstract [en]
This work revisits the classical subject of recrystallization of cold-rolled copper. Two characterization techniques are combined: three-dimensional X-ray diffraction using synchrotron X-rays, which is used to measure the growth kinetics of individual grains in situ, and electron backscatter diffraction, which is used for statistical analysis of the microstructural evolution. As the most striking result, the strong cube texture after recrystallization is found to be related to a few super large cube grains, which were named supercube grains. These few supercube grains become large due to higher growth rates. However, most other cube grains do not grow preferentially. Because of the few supercube grains, the grain size distribution after recrystallization is broad. Reasons for the higher growth rates of supercube grains are discussed, and are related to the local deformed microstructure. © 2015 Taylor & Francis.
Place, publisher, year, edition, pages
Taylor & Francis, 2015. Vol. 95, no 22, p. 2427-2449
Keywords [en]
copper, electron backscatter diffraction (EBSD), kinetics, recrystallization, texture, three-dimensional X-ray diffraction (3DXRD), Backscattering, Cold rolling, Crystallization, Electron diffraction, Enzyme kinetics, Geometry, Growth kinetics, Metal cladding, Recrystallization (metallurgy), Size distribution, Textures, X ray diffraction, Characterization techniques, Cube texture, Deformed microstructure, Electron back scatter diffraction, Grain size distribution, Individual grains, Synchrotron x rays, Grain size and shape
National Category
Mechanical Engineering Materials Engineering
Research subject
Materials Engineering; Mechanical Engineering
Identifiers
URN: urn:nbn:se:kau:diva-87230DOI: 10.1080/14786435.2015.1063787ISI: 000359608700005Scopus ID: 2-s2.0-84939244110OAI: oai:DiVA.org:kau-87230DiVA, id: diva2:1613023
2021-11-202021-11-202026-02-12Bibliographically approved